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Glossary: |
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Mutual inductance Ground bounce Capacitive crosstalk Thermal resistance Measurements Tips Meta Stability |
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Ground bounce: One of the best ways to eliminate ground bounce problem is having many ground pins in the chip packaging. Chips where multiple ground pins used, each ground pin should have a direct path to ground plane. Connecting more than one ground together and then running them through a trace to ground does not make use of having independent ground leads. Inductance of logic device packaging becomes really critical at high speeds. Double clocking of flip-flops can happen when output switching currents flow through a ground pin causing ground bounce. Capacitive crosstalk: If rise time of the clock signal get shorter, capacitive crosstalk start to become problem. Capacitive crosstalk gets worse at the higher impedance inputs Thermal resistance: Thermal resistance is the ratio of temperature rise to power dissipation. Measurements Tips: Make sure to shorten the ground loops. Shortening ground loops improves ringing and reduces rise time. Reducing loops sizes also helps to lower the inductance of the return current since inductance is almost proportional to loop area and to wire length. Increasing wire diameter has less effect than shortening the wires. Scopes ground wire loop picks up magnetic fields from the current loops on the printed circuit board. Even though the probe tip is grounded with its own ground shield, and probes ground is not connected to the digital board under testing, scope will show signal when probe tip gets close to high-speed logic board. To reduce the noise picked up by the probe grounding loop, ground the probe as close as to the signal. Also keep the grounding wire as close as possible, one common practice is to use a small knife to connect probe's ground directly to PCB's ground plane. Meta Stability: Metastability is the state which is a result of setup and hold-time violations on the flip-flops. All flip-flops have metastability. |
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